Power supply designers often find it challenging to fit all of the capacitors they need in the board space they have to work with. Conventional stacked capacitors using metal lead frames can fit more capacitance into less space, but they present performance, thermal, and assembly problems. KEMET’s KONNEKT technology is a high-density packaging technology that uses a transient liquid phase sintering process that bonds multiple MLCCs in a stack as a single surface mount component. The process occurs at low temperatures to prevent damage to the capacitors, but the resulting reacted metal matrix has a high melting point that is compatible with lead-based and lead-free solder reflow profiles. But KONNKET does more than put more capacitance in less space. The unique stacking technology reduces ESR and ESL, enabling higher ripple current capability, with low-loss orientation variants for even lower ESR. KONNEKT also has a lower thermal resistance to keep parts cooler and extend their operating life. KONNEKT technology enables a wide range of high-density, high-efficiency power applications such as Wide bandgap semiconductors, Wireless charging systems, LLC resonant converters, Data centers, and so many others, due to its compatibility with any dielectric. KONNEKT is available in KC-LINK, U2J, and X7R technologies. For more information, visit https://ec.kemet.com/konnekt/​

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Translated by CERADIR® Team